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 SEMICONDUCTOR TECHNICAL DATA
Order this document by MRF1090MA/D
The RF Line
Microwave Pulse Power Transistor
Designed for Class B and C common base amplifier applications in short pulse TACAN, IFF, and DME transmitters. * Guaranteed Performance @ 1090 MHz, 50 Vdc Output Power = 90 Watts Peak Minimum Gain = 8.4 dB * 100% Tested for Load Mismatch at All Phase Angles with 10:1 VSWR * Industry Standard Package * Nitride Passivated * Gold Metallized for Long Life and Resistance to Metal Migration * Internal Input Matching for Broadband Operation
MRF1090MA
90 W PEAK, 960-1215 MHz MICROWAVE POWER TRANSISTOR NPN SILICON
MAXIMUM RATINGS
Rating Collector-Base Voltage Emitter-Base Voltage Collector-Current -- Peak (1) Total Device Dissipation @ TC = 25C (1) (2) Derate above 25C Storage Temperature Range Symbol VCBO VEBO IC PD Tstg Value 70 4.0 6.0 290 1.66 -65 to +150 Unit Vdc Vdc Adc Watts W/C C
CASE 332-04, STYLE 1
THERMAL CHARACTERISTICS
Characteristic Thermal Resistance, Junction to Case (3) Symbol RJC Max 0.6 Unit C/W
ELECTRICAL CHARACTERISTICS (TC = 25C unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
OFF CHARACTERISTICS
Collector-Emitter Breakdown Voltage (IC = 25 mAdc, VBE = 0) Collector-Base Breakdown Voltage (IC = 25 mAdc, IE = 0) Emitter-Base Breakdown Voltage (IE = 5.0 mAdc, IC = 0) Collector Cutoff Current (VCB = 50 Vdc, IE = 0) V(BR)CES V(BR)CBO V(BR)EBO ICBO 70 70 4.0 -- -- -- -- -- -- -- -- 5.0 Vdc Vdc Vdc mAdc
ON CHARACTERISTICS
DC Current Gain (4) (IC = 2.5 Adc, VCE = 5.0 Vdc) hFE 10 30 -- --
NOTES: (continued) 1. Pulse Width = 10 s, Duty Cycle = 1%. 2. This device is designed for RF operation. The total device dissipation rating applies only when the device is operated as an RF amplifier. 3. Thermal Resistance is determined under specified RF operating conditions by infrared measurement techniques. 4. 80 s Pulse on Tektronix 576 or equivalent.
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ELECTRICAL CHARACTERISTICS -- continued (TC = 25C unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
DYNAMIC CHARACTERISTICS
Output Capacitance (VCB = 50 Vdc, IE = 0, f = 1.0 MHz) Cob -- 12 16 pF
FUNCTIONAL TESTS (Pulse Width = 10 s, Duty Cycle = 1.0%)
Common-Base Amplifier Power Gain (VCC = 50 Vdc, Pout = 90 W pk, f = 1090 MHz) Collector Efficiency (VCC = 50 Vdc, Pout = 90 W pk, f = 1090 MHz) Load Mismatch (VCC = 50 Vdc, Pout = 90 W pk, f = 1090 MHz, VSWR = 10:1 All Phase Angles) GPB No Degradation in Power Output 8.4 35 10.8 40 -- -- dB %
+ C2 L1 L2 C3 C4 + -
50 Vdc
RF INPUT Z1 Z2 Z3 Z4
DUT Z5 Z6 Z7 Z8
C1
RF OUTPUT Z9
C1, C2 -- 220 pF Chip Capacitor, 100-mil ATC C3 -- 0.1 F C4 -- 47 F/75 V L1, L2 -- 3 Turns #18 AWG, 1/8 ID Z1-Z9 -- Distributed Microstrip Elements, See Photomaster Board Material -- 0.031 Thick Glass Teflon, r = 2.5
Figure 1. 1090 MHz Test Circuit
120 Pout , OUTPUT POWER (WATTS pk) 100 1090 MHz 80 60 40 20 1215 MHz Pout , OUTPUT POWER (WATTS pk) f = 960 MHz
120 Pin = 10.5 W pk 100 80 60 40 20 VCC = 50 V tp = 10 s D = 1% 960 1090 f, FREQUENCY (MHz) 9 W pk 7.5 W pk 6 W pk 4.5 W pk
VCC = 50 V tp = 10 s D = 1% 0 3 6 9 Pin, INPUT POWER (WATTS pk) 12 15
1215
Figure 2. Output Power versus Input Power
REV 9
Figure 3. Output Power versus Frequency
2
120 Pout , OUTPUT POWER (WATTS pk) 100 80 60 40 4.5 W pk 20 0 5 10 20 30 15 25 35 VCC, SUPPLY VOLTAGE (VOLTS) 40 45 50 6 W pk f = 1090 MHz tp = 10 s D = 1% Pin = 10.5 W pk G PB , POWER GAIN (dB) 9 W pk 7.5 W pk
13 12 11 10 9 8 Po = 90 W pk VCC = 50 V tp = 10 s D = 1%
960
1090 f, FREQUENCY (MHz)
1215
Figure 4. Output Power versus Supply Voltage
Figure 5. Power Gain versus Frequency
0
+j5.0 +j10
Pout = 90 W pk VCC = 50 V tp = 10 s D = 1% +j15 f MHz 960 1090 1215 Zin Ohms 2.8 + j13.2 7.4 + j11.4 4.7 + j7.5 ZOL* Ohms 7.6 + j3.5 7.6 + j4.0 7.7 + j4.5
5.0
ZOL* 1090 1215
1215 Zin 1090
f = 960 MHz
10
f = 960 MHz
+j20
15
ZOL* = Conjugate of the optimum load ZOL* = impedance into which the device ZOL* = output operates at a given output ZOL* = power, voltage, and frequency.
Coordinates in Ohms
Figure 6. Series Equivalent Input/Output Impedance
Po = 90 W pk VCC = 50 V tp = 10 s D = 1% f = 1090 MHz
Figure 7. Typical Pulse Performance
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PACKAGE DIMENSIONS
L M K
1 2 NOTES: 1. DIMENSION K APPLIES TWO PLACES. 2. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1973. 3
4
D
A H F U
8-32 UNC 2A
J
N
C
-T-
SEATING PLANE STYLE 1: PIN 1. 2. 3. 4. BASE EMITTER BASE COLLECTOR
DIM A B C D E F H J K L M N U
MILLIMETERS MIN MAX 6.86 7.62 6.10 6.60 16.26 16.76 4.95 5.21 1.40 1.65 2.67 4.32 1.40 1.65 0.08 0.18 15.24 --2.41 2.67 45 _NOM 4.97 6.22 2.92 3.68
INCHES MIN MAX 0.270 0.300 0.240 0.260 0.640 0.660 0.195 0.205 0.055 0.065 0.105 0.170 0.055 0.065 0.003 0.007 0.600 --0.095 0.105 45 _NOM 0.180 0.245 0.115 0.145
E -B- 0.76 (0.030)
M
TB
M
CASE 332-04 ISSUE D
Specifications subject to change without notice. n North America: Tel. (800) 366-2266, Fax (800) 618-8883 n Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298 n Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
Visit www.macom.com for additional data sheets and product information.
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